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| LEADER |
00919cam a2200241 7i4500 |
| 001 |
0000078490 |
| 005 |
20230706090000.0 |
| 020 |
|
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|a 9789811999178 (electronic book)
|
| 090 |
0 |
0 |
|a TK7874
|b .L38 2023
|
| 100 |
1 |
|
|a Lau, John H
|
| 245 |
1 |
0 |
|a Chiplet design and heterogeneous integration packaging
|c John H. Lau.
|
| 264 |
|
|
|a Singapore:
|b Springer,
|c 2023.
|
| 300 |
|
|
|a 1 online resource (xxii, 525 pages):
|b illustrations, text file, PDF.
|
| 336 |
|
|
|a text
|2 rdacontent
|
| 337 |
|
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|a computer
|2 rdamedia
|
| 338 |
|
|
|a online resource
|2 rdacarrier
|
| 650 |
|
0 |
|a Microelectronic packaging
|
| 650 |
|
0 |
|a Integrated circuits --
|x Design and construction
|
| 655 |
|
0 |
|a Electronic books
|
| 856 |
4 |
2 |
|u http://library.unisel.edu.my/web/guest/mylibrary
|
| 997 |
|
|
|a Engineering & Life Sciences, Faculty
|b Engineering, Department
|
| 998 |
|
|
|a Electronics Engineering, Degree
|
| 999 |
|
|
|a EBO0020680
|b EBOOK
|c EBOOK
|e Electronic resources
|
