Chiplet design and heterogeneous integration packaging
| Main Author: | Lau, John H |
|---|---|
| Subjects: | |
| Online Access: |
http://library.unisel.edu.my/web/guest/mylibrary |
Internet
http://library.unisel.edu.my/web/guest/mylibraryElectronic resources
| Call Number: |
TK7874 L38 2023 |
|---|
| Accession No | Item Category | SMD | Status | Notes |
|---|
| EBO0020680 | EBOOK | EBOOK | AVAILABLE |