Practical guide to the packaging of electronics : thermal and mechanical design and analysis
by: Jamnia, Ali
Published: (2009)
IC assembly report lot on hold for Stats ChipPAC Malaysia
Main Author: | Thayal Ral Gobalakrishnan |
---|---|
Language: | English |
Published: |
Bestari Jaya, Selangor:
UNISEL,
2009.
|
Subjects: |
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