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| LEADER |
00948cam a2200241 7i4500 |
| 001 |
0000021403 |
| 005 |
20191017090000.0 |
| 008 |
091104 eng |
| 020 |
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|a 9780071459068 (hbk.)
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| 020 |
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|a 0071459065 (hbk.)
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| 040 |
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|a DLC
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| 090 |
0 |
0 |
|a TK7870.15
|b .T86 2008
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| 100 |
1 |
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|a Tummala, Rao R
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| 245 |
1 |
0 |
|a Introduction to system-on-package (SOP) :
|b miniaturization of the entire system
|c Rao R. Tummala, Madhavan Swaminathan.
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| 260 |
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|a New York:
|b McGraw-Hill,
|c 2008.
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| 300 |
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|a xx, 785 p.:
|b ill.;
|c 24 cm.
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| 504 |
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|a Includes bibliographical references and index
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| 650 |
0 |
0 |
|a Microelectronic packaging
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| 650 |
0 |
0 |
|a Multichip modules (Microelectronics) --
|x Design and construction
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| 700 |
1 |
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|a Swaminathan, Madhavan
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| 997 |
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|a Engineering & Life Sciences, Faculty
|b Engineering, Department
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| 998 |
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|a Electronics Engineering, Degree
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| 999 |
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|a 0000035084
|b BOK
|c OPEN SHELF
|e 2nd Floor, Bestari Jaya
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