Inside SPICE

Main Author: Kielkowski, Ron M
Published: New York: McGraw-Hill, Inc., 1998.
Edition: 2nd ed.
Series: Electronic packaging and interconnection series
Subjects:
LEADER 00817cam a2200229 7i4500
001 0000002931
005 20191009090000.0
020 |a 0079137121 (hbk.)  
020 |a 9780079137128  
090 0 0 |a TK454   |b .K54 1998 
100 1 |a Kielkowski, Ron M  
245 1 0 |a Inside SPICE   |c Ron M. Kielkowski. 
250 |a 2nd ed. 
260 |a New York:   |b McGraw-Hill, Inc.,   |c 1998. 
300 |a xv, 200 p.:   |b ill.;   |c 24 cm.. 
490 0 |a Electronic packaging and interconnection series 
504 |a Includes bibliographical references and index 
650 0 0 |a Electric circuits --   |x Computer simulation  
997 |a Engineering & Life Sciences, Faculty  |b Engineering, Department 
998 |a Electrical Engineering, Degree 
998 |a Electronics Engineering, Degree 
999 |a 0000000244  |b BOK  |c OPEN SHELF  |e 2nd Floor, Bestari Jaya