Inside SPICE

Main Author: Kielkowski, Ron M
Published: New York: McGraw-Hill, Inc., 1998.
Edition: 2nd ed.
Series: Electronic packaging and interconnection series
Subjects:
Physical Description: xv, 200 p.: ill.; 24 cm..
Bibliography: Includes bibliographical references and index
ISBN: 0079137121 (hbk.)
9780079137128