Inside SPICE
| Main Author: | Kielkowski, Ron M |
|---|---|
| Published: |
New York:
McGraw-Hill, Inc.,
1998.
|
| Edition: | 2nd ed. |
| Series: |
Electronic packaging and interconnection series
|
| Subjects: |
2nd Floor, Bestari Jaya
| Call Number: |
TK454 K54 1998 |
|---|
| Accession No | Item Category | SMD | Status | Notes |
|---|
| 0000000244 | OPEN SHELF | BOK | AVAILABLE |