Printed circuit board materials handbook

Other Authors: Jawitz, Martin W.
Published: New York: McGraw-Hill, 1997.
Series: Electronic packaging and interconnection series
Subjects:
LEADER 00788cam a2200205 7i4500
001 0000002416
005 20170218090000.0
020 |a 0070324883 (hbk.)  
020 |a 9780070324886  
090 0 0 |a TK7868.P7   |b P75 1997 
245 0 0 |a Printed circuit board materials handbook   |c Martin W. Jawitz, editor in chief. 
260 |a New York:   |b McGraw-Hill,   |c 1997. 
300 |a 1 v. (various pagings):   |b ill.;   |c 24 cm. 
490 0 |a Electronic packaging and interconnection series 
504 |a Includes bibliographical references and index 
650 0 0 |a Printed circutis --   |x Design and construction  
650 0 0 |a Printed circuits --   |x Materials  
700 1 |a Jawitz, Martin W.  
997 |a Engineering, Faculty  |b Engineering, Department 
999 |a 0000000249  |b BOK  |c REFERENCE  |e Ground Floor, Bestari Jaya