Printed circuit board materials handbook
Other Authors: | Jawitz, Martin W. |
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Published: |
New York:
McGraw-Hill,
1997.
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Series: |
Electronic packaging and interconnection series
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Subjects: |
Ground Floor, Bestari Jaya
Call Number: |
TK7868 P7 P75 1997 |
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Accession No | Item Category | SMD | Status | Notes |
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0000000249 | REFERENCE | BOK | AVAILABLE |